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XCVM1302-2MSIVSVD1760

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Shenzhen Jinsheng Weiye Electronics Co., Ltd

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XCVM1302-2MSIVSVD1760

Category : Integrated Circuits (ICs) Embedded System On Chip (SoC)

Product Status : Active

Peripherals : DDR, DMA, PCIe

Primary Attributes : Versal™ Prime FPGA, 70k Logic Cells

Series : Versal™ Prime

Package : Tray

Mfr : AMD

Supplier Device Package : 1760-FCBGA (40x40)

Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Operating Temperature : -40°C ~ 100°C (TJ)

Architecture : MPU, FPGA

Package / Case : 1760-BFBGA, FCBGA

Number of I/O : 402

RAM Size : -

Speed : 600MHz, 1.4GHz

Core Processor : Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

Flash Size : -

Description : IC VERSALPRIME ACAP FPGA 1760BGA

Stock : In Stock

Shipping Method : LCL, AIR, FCL, Express

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ Prime Versal™ Prime FPGA, 70k Logic Cells 600MHz, 1.4GHz 1760-FCBGA (40x40)

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